LOC News
Details on Semiconductor Package Delayed as Commerce Department Releases CHIPS Act Guidance
The timelines for new amendments to SB 4, which will set in motion Oregon’s semiconductor package, has been pushed to next week. The LOC and coalition partners continue to press legislative leadership for a comprehensive package that includes the full complement of recommendations from the Oregon Semiconductor Competitiveness Task Force.
Meanwhile, the U.S. Department of Commerce this week released its guidance for companies to apply for CHIPs Act funding. The department’s notice of funding opportunity (NOFO) is a comprehensive 75-page document with detailed requirements for companies planning to submit applications. Some of the requirements include a commitment to on-site day care for construction workers during the building phase and the final manufacturing facility. There are also requirements for project labor agreements prevailing wage standards, and an environmental assessment under the National Environmental Policy Act (NEPA).
Oregon’s semiconductor package is proving to be one of the more complicated legislative efforts this session. This is due to a broad range of moving parts coupled with a coalition of interest groups supporting various elements. Additionally, the coalition is working with a new legislative leadership group, as well as a large group of new legislators who don’t have the benefit of previously working on the issues included in this conversation.
With more details forthcoming, cities are advised to stay engaged with their legislators and stay tuned for more input and requests from the League. So far, city testimony has been outstanding. It is going to take a combined effort to get this semiconductor package across the finish line and make sure Oregon can take advantage of the generational investment from the CHIPS Act.
Contact: Jim McCauley, Legislative Director - jmccauley@orcities.org
Last Updated 3/3/23